Thermoconductive Adhesive AG Termopasty AG, 10g ART.AGT-116

The Thermally Conductive Adhesive Termopasty AG is ideal for efficient heat dissipation generated by electronic components.

It is used for attaching passive heat sinks to graphic memories, chip boards, or LED diodes, thus contributing to their optimal cooling.

Its advanced formula ensures high thermal conductivity and excellent adhesion, making it suitable for both personal use and complex technical applications.

The paste becomes extremely effective after drying, and once components are bonded, they cannot be removed, which guarantees a stable and long-lasting fixation.

Due to its consistency and composition, Termopasty AG is recommended for applications where

both component cooling and permanent attachment are required.

- Surface drying time (25 degrees C): 2-8 minutes

- Hardness: 45-75

- Tensile strength: 2.0 MPa

- Elongation: 100%

- Thermal conductivity: > 1.0 W/mK

- Dielectric rigidity: 20 kV/mm

- Dielectric constant: 3.0

- Dielectric loss factor (60Hz): 0.003

- Maximum operating temperature: 200 degrees C

- Weight: 10g