OEM BGA stencil for Sony PlayStation 5, CXD90060GG, 4.8cm

The OEM BGA stencil for CXD90060GG is an essential tool in the reballing process, designed for technicians specialized in repairing PlayStation 5 consoles.

Precisely engineered, this stencil allows for the realignment and correct application of solder balls on the chipset,

ensuring a stable and reliable connection on the motherboard. Made from high-quality stainless steel, the BGA stencil withstands high temperatures

and provides even heat distribution, preventing warping during the reballing process.

Exclusively compatible with the CXD90060GG chip, this tool is ideal for professional repair services

performing component-level repairs.

- Compatibility: Sony PlayStation 5 - CXD90060GG

- Material: High-temperature resistant stainless steel

- High precision: Optimized design for correct alignment of solder balls

- Usage: BGA reballing for professional repairs

- Durability: Resistant to wear and deformation