Fludor Paste Relife HW21S, Syringe Type, Melting Point 183 Degrees

Relife HW21S Solder Paste is ideal for SMT applications, BGA soldering, and LED modules, offering superior performance and protection

for temperature-sensitive components. Enriched with lead and silver, it ensures excellent conductivity

and increased solder joint strength, optimized for a soldering process at an average temperature of 183 degrees C.

Its balanced consistency prevents clumping, allows easy application, and guarantees fast soldering without false joints.

The result is clean, shiny solder joints with minimal residue, high oxidation resistance,

perfect conductivity, and no corrosive effect on the PCB, eliminating the need for cleaning after soldering.