BGA Reballing Stencil RL-044 V2.0 for Xiaomi Series CPU

The BGA Stencil Relife RL-044 V2.0 is a high-precision tool specially designed for reballing operations of processors from the Xiaomi and Redmi range.

Made from superior quality steel, it features an innovative design with round and square holes, as well as a half-cut system

that allows perfect alignment and prevents excessive solder accumulation. Each stencil has been rigorously calibrated according to the original drawings

and tested on real components to ensure that no soldering point is missed. This ensures an even application of solder paste

and proper formation of solder balls, providing technicians with a fast and efficient method to refurbish

complex integrated circuits without compromising the integrity of the motherboard.