BGA OEM Instrument, 8in1

This 8-in-1 repair set is a professional solution for the precise disassembly and cleaning of mobile phone motherboards. The set includes

a variety of specially designed metal blades for chip removal and cleaning adhesive residues from fragile components.

Each tool is made of high-quality metal, ensuring excellent durability and a long lifespan,

even under intensive daily use conditions. Thanks to its compact and portable design, you can easily carry these tools,

always ready for complex repairs in the workshop or on the field. Whether you need to lift a processor

or scrape hardened resin, this set provides you with the robustness and precision required

without damaging the surrounding circuits.